Process for reinforcing a semiconductor wafer

Details Process for reinforcing a semiconductor wafer Process for reinforcing a semiconductor wafer

1993-11-24

1995-08-29

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156286, B32B 3120

Patent

active

054456924

ABSTRACT:
A process is used for reinforcing a semiconductor wafer, where remaining bubbles in a hot-melt adhesive can be reduced in number and in size. A reinforced wafer adhering to a reinforcing plate with a heated and softened adhesive is kept in a lower ambient pressure than a standard atmosphere for a predetermined period for deaeration, and is cooled under a higher pressure than the deaeration pressure. A reinforcing plate has a groove on its adhering face.

REFERENCES:
patent: 4283242 (1981-08-01), Regler et al.
patent: 4316757 (1982-02-01), Walsh
patent: 5256599 (1993-10-01), Asetta et al.

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