Process for regenerating etching solution

Details Process for regenerating etching solution Process for regenerating etching solution

1975-08-22

1977-09-27

Prescott, Arthur C.

Chemistry: electrical and wave energy

Processes and products

Processes of treating materials by wave energy

204107, 204130, C25F 702

Patent

active

040510018

ABSTRACT:
After copper of printed circuit board lined with copper foil is etched with an acidic etching solution containing chloride ions, the resulting etching solution containing copper ions is placed in a cathode compartment partitioned with a diaphram from an anode compartment, while placing a caustic soda solution in the anode compartment, and subjected to electrolysis. In the cathode compartment, copper is deposited on an electrode without any redissolution of the deposited copper, and recovered, whereas in the anode compartment chlorine formed on an anode is absorbed into the caustic soda solution without any discharge to the atmosphere. The etching solution thus freed from the copper ions is admixed with the same kind of chemicals as consumed by the etching, and used again as a regenerated etching solution.

REFERENCES:
patent: 2748071 (1956-05-01), Eisler
patent: 2908557 (1959-10-01), Black et al.
patent: 2964453 (1960-12-01), Garn et al.
patent: 3373113 (1968-03-01), Achenbach
patent: 3400027 (1968-09-01), Radimer et al.
patent: 3761369 (1973-09-01), Tirrell
patent: 3788915 (1974-01-01), Gulla
patent: 3855141 (1974-12-01), Ruff

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