Process for regenerating an electroless copper plating bath

Chemistry: electrical and wave energy – Processes and products – Electrostatic field or electrical discharge

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204106, C25F 500

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active

047341750

ABSTRACT:
A process and an apparatus are described for regenerating an electroless copper plating bath containing a complexing agent, preferably ethylenediamine tetraacetic acid. From the bath solution to be regenerated, the copper content is reduced by electrolysis to a value below 20 mg/l and the complexing agent subsequently precipitated by acidification and recovered. After dissolution in an alkaline electrolytic solution, the solution thus obtained is fed back to the electroless copper plating bath. A particularly pure ethylenediamine tetraacetic acid free from by-products is obtained if the pH value is kept constant during electrolysis, an anodic current density i.sub.+ of 100 A/m.sup.2 is not exceeded, and the anodic current density during electrolysis is reduced according to the electrolysis characteristic or in steps.

REFERENCES:
patent: 3844799 (1974-10-01), Underkofler
patent: 4144149 (1979-03-01), Bollhalder
patent: 4302319 (1981-11-01), Ueno
patent: 4324629 (1982-04-01), Oka et al.
patent: 4425205 (1984-01-01), Honma et al.
patent: 4545877 (1985-10-01), Hillis
patent: 4549946 (1985-10-01), Horn

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