Process for reflow soldering

Details Process for reflow soldering Process for reflow soldering

1991-03-19

1991-12-31

Heinrich, Samuel M.

Metal fusion bonding

Process

With protecting of work or filler or applying flux

228220, 228223, 228248, 148 24, B23K 1005, B23K 3102, B23K 35363, B23K 3538

Patent

active

050764870

ABSTRACT:
A method of joining components to a substrate by reflow soldering with non-rosin-based flux containing solder is disclosed comprising heating the solder in the presence of the components in a low oxidizing atmosphere.

REFERENCES:
patent: 4531986 (1985-07-01), Barajas
patent: 4610391 (1986-09-01), Nowotarski
patent: 4701224 (1987-10-01), Zado
IBM Technical Disclosure Bulletin, "Joining Chip to Substrate in Oxygen-Containing Atmosphere", vol. 20, No. 6, p. 2318, 11-1977.
Multicore brochure-X32 Solder-Section 7/Apr. 1987.
Gessner G. Gawley, The Condensed Chemical Dictionary at 765 (8th Ed. 1966).
R. J. Klein Wassink, Soldering in Electronics at 261 (2nd Edition 1989).
Morris, J. R. & Bandyopadhyay, N., "No-Clean Solder Paste Reflow Processes", Printed Circuit Assembly, pp. 26-31, Feb. 1990.
IPC Standard IPC-SF-818--General Requirements for Electronic Standard Fluxes--Feb. 1988.
Federal Specification QQ-S-571E (May 5, 1972) for Solder; Tin Alloy, Tin-Lead Alloy, and Lead Alloy.

Affiliated with

Also associated with

Rating

Process for reflow soldering does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for reflow soldering, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for reflow soldering will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1504463