Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1982-05-04
1984-10-09
Lin, Kuang Y.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
228124, 228223, B23K 120
Patent
active
044756828
ABSTRACT:
Disclosed is a process for substantially reducing the series resistance of a solar cell having a thick film metal contact assembly thereon while simultaneously removing oxide coatings from the surface of the assembly prior to applying solder therewith. The process includes applying a flux to the contact assembly and heating the cell for a period of time sufficient to substantially remove the series resistance associated with the assembly by etching the assembly with the flux while simultaneously removing metal oxides from said surface of said assembly.
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Steve Hogan et al., "Evaluation of Thick-Film Inks for Solar Cell Grid Metallization", (Solar Energy Research Institute, a Division of Midwest Research Institute, Golden, Colorado 1981.
YAntonucci et al., "Prefluxing Semiconductor Chips", IBM Technical disclosure Bulletin, vol. 21, No. 6. p. 2426, 11/1978.
Barrett Joy M.
Coyle R. T.
Albrecht John M.
Esposito Michael F.
Lin Kuang Y.
Richardson Kenneth L.
The United States of America as represented by the United States
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