Process for radiation cured conjugated diene-vinyl aromatic hydr

Details Process for radiation cured conjugated diene-vinyl aromatic hydr Process for radiation cured conjugated diene-vinyl aromatic hydr

1993-07-12

1999-02-02

Jordan, Charles T.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Compositions to be polymerized by wave energy wherein said...

C08F 246

Patent

active

H00017868

ABSTRACT:
In a process of curing epoxidized polymers of conjugated dienes which contain aromatic moieties by exposing the polymers to ultraviolet radiation in the presence of a photoinitiator, the improvement which comprises reducing the amount of irradiation necessary to achieve an effective cure by adding a small but effective amount of a photosensitizer which absorbs UV radiation in a wavelength range which is not obscured by the polymer to the polymer prior to or during irradiation.

REFERENCES:
patent: 4237245 (1980-12-01), Halasa et al.
patent: 4816496 (1989-03-01), Wada et al.
patent: 5149895 (1992-09-01), Coolbaugh et al.
patent: 5210359 (1993-05-01), Coolbaugh et al.
patent: 5229464 (1993-07-01), Erickson et al.
patent: 5247026 (1993-09-01), Erickson et al.
J. V. Crivello, and J. L. Lee, "Alkoxy-Substituted Diaryliodonium Salt Cationic Photoinitiators," J. Polymer Science: Part A: Polymer Chemistry, vol. 27, 3951-3968 (1989).
J. V. Crivello and H. Sasaki, "Synthesis and Photopolymerization of Silicon-Containing Multifunctional Oxetane Monomers," J.M.S.-Pure Appl. Chem., A30(2&3), 173-187 (1993).

Affiliated with

Also associated with

Rating

Process for radiation cured conjugated diene-vinyl aromatic hydr does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for radiation cured conjugated diene-vinyl aromatic hydr, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for radiation cured conjugated diene-vinyl aromatic hydr will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1106446