Process for pulse electroplating electroactive polymers and arti

Details Process for pulse electroplating electroactive polymers and arti Process for pulse electroplating electroactive polymers and arti

1989-09-22

1991-05-14

Niebling, John F.

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

204 15, 204 30, 204 381, 204 384, 204 40, 204DIG9, 428646, 428647, 428669, 428672, 428675, 428935, 430314, C25D 510, C25D 556

Patent

active

050155385

ABSTRACT:
The invention consists of a process for pulse electroplating electroactive polymer substrates at potentials sufficient to cause reduction of the substrates. The inventive process can be used to make polymer-metal composites having one or more metal films. More specifically, it can be used to electroplate polyimide substrates with gold, or to electroplate gold over a copper plated polyimide substrate. These inventive composites exhibit improved polymer-metal adhesion when they are exposed to elevated temperatures and humidities, i.e., 85.degree. C. and 85% R.H.

REFERENCES:
patent: 4512855 (1985-04-01), Mazur
patent: 4710403 (1987-12-01), Krause et al.
patent: 4775556 (1988-10-01), Krause et al.
patent: 4830903 (1989-05-01), Levy
"Pulse-Plated Gold," Plating and Surface Finishing, C. J. Raub and A. Knodler, pp. 32-33.
"An Overview of Pulse Plating," Plating and Surface Finishing, Norman M. Osero, Mar., 1986, pp. 20-22.
P. G. Pickup et al., Electrodeposition of Metal Particles and Films by a Reducing Redox Polymer, J. Electrochem. Soc., vol. 130, No. 11, 1983, pp. 2205-2216.

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