Process for providing interconnect bumps on a bonding pad by app

Details Process for providing interconnect bumps on a bonding pad by app Process for providing interconnect bumps on a bonding pad by app

1995-11-03

1996-10-22

Fourson, George

Fishing, trapping, and vermin destroying

22818022, H01L 21283, H01L 2148

Patent

active

055676480

ABSTRACT:
A method for forming conductive interconnect bumps, such as solder bumps, on bond pads on a substrate. The method includes conductive discs and a connecting member formed between two adjacent conductive discs. The discs and connecting member are then placed over the bond pads and heat is applied so that the conductive discs and the connecting member combine to form isolated interconnect bumps. A polymer backsheet is used for support.

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