Stock material or miscellaneous articles – Structurally defined web or sheet – Including aperture
Patent
1987-05-20
1989-02-21
Arbes, Carl J.
Stock material or miscellaneous articles
Structurally defined web or sheet
Including aperture
29827, 174 524, 357 70, 428209, 428901, B32B 310, H01R 4300
Patent
active
048064092
ABSTRACT:
A flexible tape having a desired metal foil circuit pattern and a process for manufacturing such a tape. The starting tape comprises a non-metallic flexible substrate having a metal foil layer adhered thereto. The foil layer is patterned to form a desired circuit pattern and a pattern comprising bussing means. The foil is electroplated by connection of the electroplating circuitry to the bussing means. Thereafter, the tape is reduced in width by removing the bussing means and the underlying flexible substrate.
REFERENCES:
patent: 3440027 (1969-04-01), Hugle
patent: 3611061 (1971-10-01), Segerson
patent: 3773628 (1973-11-01), Misawa et al.
patent: 4049903 (1977-09-01), Kobler
patent: 4407440 (1983-10-01), Manning
patent: 4411982 (1983-10-01), Shibuya et al.
patent: 4466183 (1984-08-01), Burns
patent: 4472876 (1984-09-01), Nelson
patent: 4510017 (1985-04-01), Barber
patent: 4607276 (1986-08-01), Butt
patent: 4635092 (1987-01-01), Verman et al.
patent: 4701363 (1987-10-01), Barber
patent: 4721993 (1988-01-01), Walter
patent: 4735678 (1988-04-01), Mandigo et al.
patent: 4736236 (1988-04-01), Butt
patent: 4736882 (1988-04-01), Winter et al.
"TAB Technology Tackles High Density Interconnections" by Tom Dixon, Dec. 1984, vol. of Electronic Packaging & Production, pp. 34-39.
Sharenow Brett
Voss Scott V.
Walker Robert
Walter Jackie A.
Arbes Carl J.
Olin Corporation
Rosenblatt Gregory S.
Weinstein Paul
LandOfFree
Process for providing an improved electroplated tape automated b does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for providing an improved electroplated tape automated b, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for providing an improved electroplated tape automated b will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1521350