Metal working – Method of mechanical manufacture – Electrical device making
Patent
1986-03-05
1987-11-10
Goldberg, Howard N.
Metal working
Method of mechanical manufacture
Electrical device making
427 97, H01K 310
Patent
active
047047917
ABSTRACT:
At least two conductors are electrically connected through a dielectric material by providing a dielectric material having a first conductor on a first surface thereof and a temporary support layer covering the first conductor and the first surface of the dielectric material.
A second surface on the dielectric material opposite the first surface is provided with a second conductor and a temporary support layer covering the second conductor and second surface of the dielectric material.
Interstitial through-holes are provided to connect the first and second conductors. The through-holes are plated with an electrical conductor to thereby electrically connect the first and second conductors. The support layers are then mechanically removed such as by peeling to thereby provide a landless electrical connection between the first and second electrical conductors.
REFERENCES:
patent: 2986804 (1961-06-01), Greenman et al.
patent: 3163588 (1964-12-01), Shortt et al.
patent: 4354895 (1982-10-01), Ellis
patent: 4604799 (1986-08-01), Gurol
IBM Tech Disclosure Bull., vol. 22, No. 10, Mar. 1980, p. 4468 by Bupp et al.
IBM Technical Disclosure Bulletin, vol. 9, No. 10, Mar. 1967, Crimi, et al., "Landless Hole Circuit Card", pp. 1310-1311.
IBM Technical Disclosure Bulletin, vol. 13, No. 1, Jun. 1970, Mead, "Landless Plated Through-Hole Process", p. 181.
IBM Technical Disclosure Bulletin, vol. 15, No. 10, Mar. 1973, Chumbres, et al., "Landless Plated-Through Hole Photoresist Masking Process", pp. 3298-3299.
IBM Technical Disclosure Bulletin, vol. 27, No. 5, Oct. 1984, Chellis, et al., "Signal Core by Direct Circuit Deposition", pp. 2829-2930.
Chellis Leroy N.
Ellis Theron L.
Arbes Carl J.
Goldberg Howard N.
International Business Machines - Corporation
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