Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1984-06-05
1985-05-21
Dawson, Robert A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
29459, 148 614R, 156629, 156645, 156666, 428628, 428639, 428675, B32B 3112
Patent
active
045184496
ABSTRACT:
A process for producing cooper foil laminated plates using rolled copper foils made of oxygen-free copper is described. The major feature of the present process is that in laminating a rolled copper foil on an insulating substrate, the rolled copper foil is ground or abraded and immediately brought into contact with water or steam to form a hydrate layer on the surface thereof. This hydrate layer increases the adhesion strength of the rolled copper foil to the insulating substrate through an adhesive, producing a copper foil laminated plate having an adhesion strength sufficiently high for practical use. Thus these copper foil laminated plates are very suitable for use in wiring of electronic devices.
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patent: 3544389 (1970-12-01), Vazirani
patent: 4292095 (1981-09-01), Schlinsog
patent: 4409037 (1983-10-01), Landau
patent: 4428987 (1984-01-01), Bell et al.
patent: 4434022 (1984-02-01), Kamada et al.
Dawson Robert A.
Hitachi Cable Limited
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