Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1988-09-23
1990-08-14
Ball, Michael W.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156173, 156175, 156267, 156296, 2103218, 21032189, B01D 6302, B01D 6700, B01D 6908
Patent
active
049484443
ABSTRACT:
The invention relates to a process and an apparatus for the production of a bundle of filaments from at least one filament, and its application especially to the production of a bundle of hollow semi-permeable fibers used for producing a filtration module. According to this invention, the filaments (1) is wound in a first step, in several superposed layers around a support plate (10) having two take-up edges (17) perpendicular to the direction of winding of the filament, and conferring on this filament an alternating transverse movement of decreasing amplitude in such a manner as to achieve a winding having a predetermined profile. The support plate (10) is then removed by retracting the take-up edges (17) toward each other so as to obtain a bundle having a transverse section which is a function of the profile of the winding and curved ends.
REFERENCES:
patent: 2237178 (1941-04-01), Freeman
patent: 3442002 (1969-05-01), Geary, Jr. et al.
patent: 4226378 (1980-10-01), Fitzgerald et al.
patent: 4446024 (1984-05-01), Baker
patent: 4647523 (1987-03-01), Bach
patent: 4666543 (1987-05-01), Kawano
Paris Patrick
Schutz Richard A.
Aftergut Jeff H.
Ball Michael W.
Dutton, Jr. Harold H.
Societe Lyonnaise des Eaux
LandOfFree
Process for production of a bundle of hollow semi-permeable fibe does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for production of a bundle of hollow semi-permeable fibe, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for production of a bundle of hollow semi-permeable fibe will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-460484