Process for producing wiring circuit board

Details Process for producing wiring circuit board Process for producing wiring circuit board

2007-05-15

2009-08-11

Tucker, Philip C (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S297000, C156S299000, C156S300000, C156S301000, C156S302000, C156S303000, C430S311000, C430S961000

Reexamination Certificate

active

07572351

ABSTRACT:
The invention provides a process for producing a wiring circuit board, which comprises the steps of: (A) forming a conductor layer of a predetermined pattern on an insulating layer; (B) forming a photosensitive solder resist layer on the insulating layer and the patterned conductor layer formed on the insulating layer; (C) disposing a transparent protective film on the photosensitive solder resist layer; and (D) exposing the photosensitive solder resist layer to a light through the transparent protective film.

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English Abstract of JP 2003-149804.
Machine English translation of JP 2003-149804.
Japanese Office Action dated Jun. 13, 2006.
European Search Report dated Apr. 16, 2007.
Chinese Office Action dated Aug. 15, 2008.
Korean Office Action dated Jan. 20, 2009.

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