Process for producing very thin semiconductor chips

Details Process for producing very thin semiconductor chips Process for producing very thin semiconductor chips

1998-11-25

2000-04-04

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438119, 438127, H01L 2144

Patent

active

060460733

ABSTRACT:
The novel process facilitates the production of very thin semiconductor chips with thicknesses down to a few .mu.m. The semiconductor chip is first of all arranged on contact surfaces, with the active side oriented toward the contact surfaces. The chip is then electrically connected to the contact surfaces via contact studs. Silicon is then removed from the exposed rear side of the semiconductor chip during a plasma etching process which has high selectivity with respect to the other materials.

REFERENCES:
patent: 5273940 (1993-12-01), Sanders
patent: 5496764 (1996-03-01), Sun
patent: 5645707 (1997-07-01), Omoto
patent: 5668059 (1997-09-01), Christie et al.
patent: 5677243 (1997-10-01), Maeta et al.
patent: 5786242 (1998-07-01), Takemura et al.
patent: 5824595 (1998-10-01), Igel et al.

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