Process for producing substrate for flexible circuit board

Details Process for producing substrate for flexible circuit board Process for producing substrate for flexible circuit board

2007-03-06

2007-03-06

Aftergut, Jeff H. (Department: 1733)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S313000, C156S330900, C428S458000

Reexamination Certificate

active

11006698

ABSTRACT:
The invention provides a process for producing a substrate for flexible circuit boards which comprises: providing a multilayered insulating resin layer comprising an insulating layer and an adhesive layer; and laminating a metal foil to the insulating layer of the multilayered insulating resin layer via the adhesive layer at a temperature not lower than the glass transition temperature of the insulating layer.

REFERENCES:
patent: 6379784 (2002-04-01), Yamamoto et al.
patent: 7101455 (2006-09-01), Hase et al.
patent: 0221592 (1989-02-01), None
patent: 2001170953 (2001-06-01), None
patent: 2002-326308 (2002-11-01), None
WO 01/32418 A1 May, 2001.
Abstract for JP 0221592.
Abstract for JP 2001170953.

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