Process for producing sputtering target materials

Details Process for producing sputtering target materials Process for producing sputtering target materials

2001-04-10

2002-08-06

King, Roy (Department: 1742)

Metal treatment

Process of modifying or maintaining internal physical...

Heating or cooling of solid metal

C148S679000, C148S680000, C148S684000, C148S688000, C148S691000, C148S695000

Reexamination Certificate

active

06428638

ABSTRACT:

SUMMARY OF THE INVENTION
The invention encompasses methods of reducing grain sizes of materials, and in particular applications encompasses methods of reducing grain sizes of titanium-comprising materials, aluminum-comprising materials, and/or copper-comprising materials. The invention further encompasses methods of forming sputtering targets. In a particular embodiment, the invention encompasses a method for producing a sputtering target material in which a metallic material is subjected to plastic working at a processing percentage of at least 5% utilizing a processing rate of at least 100% per second (i.e., 100%/second). In particular applications the metallic material comprises one or more of aluminum, copper and titanium.


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