Process for producing spatially patterned components

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices

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Details

438122, 438415, 257713, 257717, H01L21/302

Patent

active

059021209

ABSTRACT:
A process is disclosed for producing spatially patterned components from a body. On the backside of the body, a retardation layer with openings is provided for retarding a removal of the material of the body, and areas of migration-capable material are deposited. The body is subjected to a thermal migration process to form migration regions. Then, in a single material removal step, the components are separated from the body and the migration regions are exposed.

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