Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Patent
1998-03-13
1999-05-11
Bowers, Charles
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
438122, 438415, 257713, 257717, H01L21/302
Patent
active
059021209
ABSTRACT:
A process is disclosed for producing spatially patterned components from a body. On the backside of the body, a retardation layer with openings is provided for retarding a removal of the material of the body, and areas of migration-capable material are deposited. The body is subjected to a thermal migration process to form migration regions. Then, in a single material removal step, the components are separated from the body and the migration regions are exposed.
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Igel Guenter
Mall Martin
Bowers Charles
Micronas Intermetall GmbH
Plevy Arthur L.
Sulsky Martin
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