Metal working – Barrier layer or semiconductor device making – Barrier layer device making
Patent
1991-03-19
1991-12-31
Hearn, Brian E.
Metal working
Barrier layer or semiconductor device making
Barrier layer device making
361529, 361541, 437919, 437205, 148DIG14, H01G 538, H01G 905
Patent
active
050759400
ABSTRACT:
The present invention provides a process which is particularly suited for mass-producing solid electrolytic capacitors. The process utilizes a combination of a mold and a presser member. The mold has a series of molding recesses, and a lead receiving groove extending along and through the series of molding recesses. The presser member has a corresponding series of pressing projections. A portion of a continuous lead wire is placed in the groove, and powdered electrode material is loaded in the molding recesses. The presser member is then moved toward the mold, so that the powdered material is compacted within the molding recesses by the pressing projections. The resulting compacts are removed from the mold together with the wire. The same process steps are repeated with respect to other portions of the wire.
REFERENCES:
patent: 2987800 (1961-06-01), Kurland et al.
patent: 3403303 (1968-09-01), Klein
patent: 3412444 (1968-11-01), Klein
patent: 3424952 (1969-01-01), Vierow
patent: 4417298 (1983-11-01), Nakata et al.
patent: 4881149 (1989-11-01), Tokura et al.
patent: 4945452 (1990-07-01), Sturmer et al.
Hasegawa Miki
Kuriyama Chojiro
Oshima Tatsuhiko
Eilberg William H.
Hearn Brian E.
Rohm & Co., Ltd.
Trinh Michael
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