Process for producing semiconductor devices using resin tablets

Details Process for producing semiconductor devices using resin tablets Process for producing semiconductor devices using resin tablets

1995-06-05

1997-07-08

Bleutoe, John C.

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

2643284, 2643285, 26433112, B29C 4502, B29C 4514

Patent

active

056457871

ABSTRACT:
A resin tablet for sealing by transfer molding a semiconductor, which is obtained by cooling and solidifying a molten resin composition, is disclosed. The tablet has a compressibility of not less than 98% and a metallic impurity content of less than 50 ppm, preferably with the amount of fine powders of 250 mesh or smaller adhered thereto being controlled below 0.05% by weight based on the tablet and a water content being controlled below 0.1% by weight.

REFERENCES:
patent: 4554126 (1985-11-01), Sera
patent: 4963307 (1990-10-01), Sakai
JP 61-035908, Abstract #86-035808, Japan Patent Information Organization (JAPIO), Tokyo, Japan (1988).
JP 61-035908, Abstract #86-090636, Derwent, Inc., McClean, VA.

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