Process for producing semiconductor device

Details Process for producing semiconductor device Process for producing semiconductor device

2003-12-18

2009-02-10

Chang, Rick K (Department: 3726)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S832000, C029S840000, C156S230000

Reexamination Certificate

active

07487586

ABSTRACT:
A process for semiconductor device production by which the reliability of connection with bumps can be easily heightened with higher certainty. The process for producing a semiconductor device comprising a substrate having bumps formed thereon, comprises covering the bumps with an adhesive film which has a modulus of elasticity (−55° C.) of from 100 MPa to 5 GPa and has a thickness corresponding to from 5 to 40% of the height of the bumps, and then disposing the adhesive film on the substrate so that the bumps pierce through the adhesive film and come to protrude therefrom.

REFERENCES:
patent: 5757078 (1998-05-01), Matsuda et al.
patent: 6652688 (2003-11-01), Matsumura et al.
patent: 2000-208547 (2000-07-01), None
patent: 2003-077944 (2003-03-01), None
patent: WO 02/24391 (2002-03-01), None

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