Process for producing semiconductor chips having a...

Details Process for producing semiconductor chips having a... Process for producing semiconductor chips having a...

2007-06-26

2007-06-26

Zarneke, David A. (Department: 2891)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

C156S289000, C257SE21599

Reexamination Certificate

active

11113481

ABSTRACT:
A process for producing semiconductor chips having a protective film on the back surface includes the steps of: providing a sheet to form the protective film having a release sheet and a protective film-forming layer formed on a detachable surface of the release sheet, wherein the protective film-forming layer includes a thermosetting component, an energy ray-curable component and a binder polymer component; adhering a protective film-forming layer of the sheet to form the protective film onto a back surface of a semiconductor wafer having circuits on its surface; curing the protective film-forming layer by irradiation with an energy ray, and thereafter, further conducting the additional steps of (in any order): detaching the release sheet from the protective film-forming layer; further curing the protective film-forming layer by heating; and dicing the semiconductor wafer together with the protective film-forming layer with respect to each circuit.

REFERENCES:
patent: 4756968 (1988-07-01), Ebe et al.
patent: 4793883 (1988-12-01), Sheyon et al.
patent: 5110388 (1992-05-01), Komiyama et al.
patent: 6007920 (1999-12-01), Umehara et al.
patent: 6245382 (2001-06-01), Shvartsman et al.
patent: 6297131 (2001-10-01), Yamada et al.
patent: 0 157 508 (1985-10-01), None
patent: 0 359 373 (1990-03-01), None
patent: 60-223139 (1985-11-01), None
patent: 8-239636 (1996-09-01), None
patent: 10-335271 (1998-12-01), None
patent: WO 00/50250 (2000-08-01), None

Affiliated with

Also associated with

Rating

Process for producing semiconductor chips having a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for producing semiconductor chips having a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for producing semiconductor chips having a... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3830139