Process for producing semiconductor chips

Details Process for producing semiconductor chips Process for producing semiconductor chips

2005-07-19

2005-07-19

Zarneke, David A. (Department: 2829)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

C156S289000

Reexamination Certificate

active

06919262

ABSTRACT:
The present invention provides a sheet to form a protective film for chips, which can be readily formed into a highly uniform protective film on a back surface of chip, and which, even if minute scratches are formed on the back surface of chip as a result of mechanical grinding, can eliminate adverse effects resulting from the scratches. The sheet to form a protective film for chips of the present invention comprises a release sheet and a protective film forming layer formed on a detachable surface of the release sheet, wherein said protective film forming layer comprises a thermosetting or energy ray-curable component and a binder polymer component.

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