Process for producing resin-sealed type electronic device

Details Process for producing resin-sealed type electronic device Process for producing resin-sealed type electronic device

2006-11-14

2006-11-14

Kebede, Brook (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C257S667000, C257SE23116, C257SE21499

Reexamination Certificate

active

07135358

ABSTRACT:
There is disclosed a process for producing a resin-sealed type electronic device which comprises forming a dam frame on edge and side portions of a substrate loaded with a single or a plurality of electronic elements so as to encompass the electronic elements by sticking down a pressure sensitive adhesive sheet to the substrate, pouring a resin for sealing in the inside of the dam frame, and heat-curing the poured resin. The process dispenses with an intricate production step or a long time in forming the dam frame, thus enabling forming of the same with a minimized number of production steps and in the shortest amount of time possible.

REFERENCES:
patent: 6444499 (2002-09-01), Swiss et al.
patent: 2003/0173655 (2003-09-01), Rissing et al.
patent: 09301480 (1997-11-01), None

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