Process for producing printed wiring board

Details Process for producing printed wiring board Process for producing printed wiring board

1987-05-06

1988-12-13

Kittle, John E.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

2281802, 29423, 29424, 428901, B32B 3100, B23K 3102, B23P 1700

Patent

active

047908947

ABSTRACT:
A base board having a plurality of semicircular through-holes filled with solder at side walls produced by filling through-holes with solder can be connected electrically to printed circuit boards with large connecting strength and high reliability.

REFERENCES:
patent: 3357099 (1967-12-01), Nagy et al.
patent: 4064623 (1977-12-01), Moore
patent: 4352449 (1982-10-01), Hall et al.

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