Process for producing printed-wiring board

Details Process for producing printed-wiring board Process for producing printed-wiring board

1982-09-17

1986-05-06

Kimlin, Edward

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156240, 156241, 156289, 156297, 29825, 428447, B44C 116, B32B 904, B32B 3100, H01R 4300

Patent

active

045869766

ABSTRACT:
A process for producing a printed-wiring board is disclosed. The process involves providing a metal carried support surface and forming a resist pattern on the metal surface comprised of a silicone rubber material. The support surface where there is not resist is metal plated to provide metal plated surface portions which are contact bonded to a insulating base material by interposing an adhesive between the insulating base material and the metal surface portions or contact bonded to an uncured base material having an adhesive force. The contact bonding is carried out in order to transfer the metal surface portions onto the base material thus forming the conductor pattern on the base material and producing the printing-wiring board. The process eliminates the loss of expensive copper foil and provides a method by which the base material can be securely bonded to the metal portions forming the printed-wiring board.

REFERENCES:
patent: 2984597 (1961-05-01), Hennes
patent: 3340607 (1967-09-01), Shutt
patent: 3706593 (1972-12-01), Miyano et al.
patent: 3782940 (1974-01-01), Ohto
patent: 3998601 (1976-12-01), Yates et al.
patent: 4159222 (1979-06-01), Lebow et al.
patent: 4357395 (1982-11-01), Lifshin et al.

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