Process for producing printed wiring board

Metal working – Method of mechanical manufacture – Electrical device making

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29830, 430315, H05K 306

Patent

active

054387515

ABSTRACT:
In an additive process for producing printed wiring boards, by using a developer comprising a chlorine-free organic solvent and an alkaline aqueous solution and as a resist material a copolymer of methacrylic acid and methyl methacrylate or the like, the production steps are simplified even if a substrate having a large area is used, and abolishment of chlorine-containing organic solvent as a developer becomes possible.

REFERENCES:
patent: 3311966 (1967-04-01), Shaheen et al.
patent: 3883352 (1975-05-01), Kloczewski et al.
patent: 4268614 (1981-05-01), Ueyama et al.
patent: 4761303 (1988-08-01), Ruozczyk et al.
patent: 5092032 (1992-03-01), Murakami
"Resist For Photo-Additive Printed Wiring Boards", Masui et al., Technical Paper, Printed Circuit World Convention IV, Tokyo Japan Jun. 1987.

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