Process for producing printed circuits and printed circuits...

Details Process for producing printed circuits and printed circuits... Process for producing printed circuits and printed circuits...

2005-02-22

2005-02-22

Pert, Evan (Department: 2827)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000

Reexamination Certificate

active

06858806

ABSTRACT:
There is described a process for producing printed circuits comprising a laminar support, an electrically conductive track on the laminar support, and an auxiliary conductive element soldered to the conductive track. There is a provision to apply the auxiliary conductive element by means of an apparatus for applying SMD components.

REFERENCES:
patent: 4617729 (1986-10-01), Celnik
patent: 4873764 (1989-10-01), Grimm
patent: 4875285 (1989-10-01), Haan et al.
patent: 4934578 (1990-06-01), Fritsch
patent: 4948026 (1990-08-01), Fritsch
patent: 4982376 (1991-01-01), Megens et al.
patent: 5084961 (1992-02-01), Yoshikawa
patent: 5105532 (1992-04-01), Fritsch
patent: 5157734 (1992-10-01), Chen et al.
patent: 5195154 (1993-03-01), Uchida
patent: 5220724 (1993-06-01), Gerstner
patent: 5250469 (1993-10-01), Tanaka et al.
patent: 5258738 (1993-11-01), Schat
patent: 5321885 (1994-06-01), Hino et al.
patent: 5323528 (1994-06-01), Baker
patent: 5349504 (1994-09-01), Simms et al.
patent: 5373111 (1994-12-01), McClure et al.
patent: 5377405 (1995-01-01), Sakurai et al.
patent: 5410801 (1995-05-01), Shiloh et al.
patent: 5413275 (1995-05-01), Verguld et al.
patent: 5461202 (1995-10-01), Sera et al.
patent: 5498575 (1996-03-01), Onishi et al.
patent: 5563572 (1996-10-01), Hetzler
patent: 5659947 (1997-08-01), Eilers et al.
patent: 5683566 (1997-11-01), Hetzler
patent: 5699611 (1997-12-01), Kurogi et al.
patent: 5729896 (1998-03-01), Dalal et al.
patent: 5896081 (1999-04-01), Tzeng et al.
patent: 5974661 (1999-11-01), Neuhalfen
patent: 6108210 (2000-08-01), Chung
patent: 6151771 (2000-11-01), Tzeng et al.
patent: 6323440 (2001-11-01), Maruyama et al.
patent: 6350957 (2002-02-01), Shingai et al.
patent: 6457234 (2002-10-01), Edelstein et al.
Circuit Board Soldering Through Conformal Coating, Research Disclosure, Sep. 1988, No. 293, Kenneth Mason Publications.
PCT International Application (France), International Publicaton No. WO 95/13632 published May 18, 1995.
Patent Abstract of Japan, vol. 14, No 99 (E-0893), Feb. 22, 1990 regarding Publication No. 01303793 published Jul. 12, 1989.
Patent Abstracts of Japan, volume and number unknown, regarding Japanese Abstract Publication No. 06196851 published Jul. 15, 1994.
R. Keller; “Insights and observations on mixed-technology assembly” Electronic Packaging and Production., vol. 28 No 4, Apr. 1988, Massachusetts, pp. 34-37, XPO00140055.
German Patent No. DE 44 25 803 A 1 issued Jul. 21, 1994.

Affiliated with

Also associated with

Rating

Process for producing printed circuits and printed circuits... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for producing printed circuits and printed circuits..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for producing printed circuits and printed circuits... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3510792