Chemistry: electrical and wave energy – Processes and products
Patent
1986-05-05
1988-01-26
Tufariello, T. M.
Chemistry: electrical and wave energy
Processes and products
204 384, C25D 502, C25D 554
Patent
active
047215500
ABSTRACT:
A process is disclosed for forming a printed circuit board having improved adhesion of an electrically conductive layer to an underlying dielectric surface. A thin adhesive layer, or film, of conductive material (normally copper) is sputtered onto a dielectric substrate and through holes formed therein, after which the substrate, with the then amorphous sputtered layer thereon, is further processed in a manner so as not to damage adhesion of the sputtered layer to the substrate. The initial step of this further processing can be accomplished chemically or mechanically, and preferably is accomplished by electroplating a buffer, or transition, layer of conductive material onto the sputtered layer with the buffer layer being deposited by placing the substrate, having the sputtered layer thereon, in a first electroplating bath to produce an electroplated layer having no deposit stress or a slightly compressive deposit stress. Additional plating is thereafter carried out in a second electroplating bath having high throwing power, as is needed for plating inside holes for printed circuit applications, and this produces an electroplated layer having tensile deposit stress to thereby provide a uniform conductive material on the substrate and through the holes that is suitable for providing the electrically conductive traces of a printed circuit.
REFERENCES:
patent: 2984595 (1961-05-01), Schumpelt et al.
patent: 3294654 (1966-12-01), Norman
patent: 4077854 (1978-03-01), Estep
patent: 4153518 (1979-05-01), Holmes
patent: 4167601 (1979-09-01), Beckenbaugh et al.
patent: 4228213 (1980-10-01), Bechenbaugh et al.
Harris Robert E.
New West Technology Corporation
Tufariello T. M.
LandOfFree
Process for producing printed circuit board having improved adhe does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for producing printed circuit board having improved adhe, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for producing printed circuit board having improved adhe will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1467025