Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1981-08-31
1983-03-29
Smith, John D.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 98, C23C 302, H05K 318
Patent
active
043783848
ABSTRACT:
A process for producing a printed circuit board which comprises forming a plating film forming adhesive layer on the whole exposed surface of an insulating board, roughening said adhesive layer surface, depositing a catalyst for electroless copper plating on said adhesive layer surface from a catalyst solution, masking the thus treated insulating board surface excepting the part where a circuit is to be formed, and then performing the electroless copper plating on the catalyst of the board to form a circuit thereon, wherein an improvement comprises treating the roughened adhesive layer surface with an alkaline solution before depositing the catalyst thereon and treating the masked insulating board with an aqueous solution containing a surfactant before performing the electroless copper plating. The above process assures a higher copper utilization and a large adhesive strength of the copper plating to the board.
REFERENCES:
patent: 3982045 (1976-09-01), Kukanskis
patent: 4293592 (1981-10-01), Morishita et al.
Itoh Yutaka
Kawakubo Shoji
Kawamoto Mineo
Matsuda Youichi
Murakami Kanji
Hitachi , Ltd.
Smith John D.
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