Process for producing printed-circuit board

Details Process for producing printed-circuit board Process for producing printed-circuit board

1990-12-10

1991-09-03

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

156651, 156655, 427 98, H05K 312

Patent

active

050440730

ABSTRACT:
Disclosed herein is a process which makes it possible to greatly improve the insulation resistance between conductors on a printed-circuit board having a layer formed by electroless copper plating, and hence it provides a printed circuit board with extremely high reliability. According to the process, a printed-circuit board is formed by forming a metal coating film on a resin board by electroless plating after activation, etching the metal coating film, thereby forming printed conductors, and etching at least the exposed surface of the resin board which is not covered by the printed conductors.

REFERENCES:
patent: 3455751 (1969-07-01), Frantzen
patent: 3620933 (1971-11-01), Grunwald
patent: 3871930 (1975-03-01), Fish
patent: 4039371 (1977-08-01), Brunner et al.
patent: 4232060 (1980-11-01), Mallory, Jr.
patent: 4298424 (1981-11-01), Terada et al.
patent: 4611417 (1987-03-01), Schumacher, III et al.
patent: 4770899 (1988-09-01), Zeller
IBM Tech. Discl. Bull. vol. 20, No. 2, Jul. 1977, pp. 525-526 by H. C. Cook et al.

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