Process for producing printed circuit board

Details Process for producing printed circuit board Process for producing printed circuit board

1985-02-14

1986-04-29

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29852, 156645, 156656, 156666, 156668, 156902, 427 97, 427302, 427307, B32B 3100, B05D 512, B44C 122, C23F 100

Patent

active

045855021

ABSTRACT:
A process for producing a printed circuit board characterized by forming a thermosetting resin layer on internal walls of through holes before an electroless plating treatment can produce printed circuit boards having high reliability without causing blow-holes on the through hole walls.

REFERENCES:
patent: 3322881 (1967-05-01), Schneble et al.
patent: 3672986 (1972-06-01), Schneble et al.
patent: 3956041 (1976-05-01), Polichette et al.
patent: 4339303 (1982-07-01), Frisch et al.

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