Process for producing patterns in dielectric layers formed by pl

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427 38, 427 431, B05D 306

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active

048449458

ABSTRACT:
A process for forming a dielectric patterned layer of any desired geometry on a selected substrate which includes vapor depositing selected reactants on said substrate only in areas thereon which are coextensive with the surface area of an adjacent metal electrode pattern.

REFERENCES:
patent: 4550257 (1985-10-01), Binnig et al.
Bunshah et al., Deposition Technologies for Films & Coatings, (Noyes, Park Ridge, NJ.)/. 1982, pp. 365-384.

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