Process for producing multiple wire wiring board

Details Process for producing multiple wire wiring board Process for producing multiple wire wiring board

1995-06-05

1996-12-17

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

174251, B32B 3100

Patent

active

055841210

ABSTRACT:
An adhesive comprising (a) solid epoxy resin having a molecular weight of 5000 or more, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy modified polybutadiene having at least three epoxy groups, (d) a cationic photoinitiator, and (e) a tin compound in special weight ratios, is effective for producing multiple wire wiring boards having good heat resistance, solvent resistance wherein the adhesive layer has no voids and prevents shift of insulated encapsulated wires.

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patent: 4972050 (1990-11-01), Hammond et al.
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