Process for producing multilayered printed board

Details Process for producing multilayered printed board Process for producing multilayered printed board

1991-07-30

1993-10-12

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 96, 427 97, 427337, C23C 2600

Patent

active

052523551

ABSTRACT:
A process for producing a multilayered printed circuit board which comprises using, as an intermediate layer, an inner-layer board obtained by chemically oxidizing the surface of a copper foil constituting an outermost layer of an inner-layer board having a printed circuit formed in the copper foil, thereby to form on the surface a finely roughened layer constituted by a copper oxide of a brown to black color, and then reducing the copper oxide constituting the finely roughened layer in an atmosphere in which a reducing gas is present.

REFERENCES:
patent: 4775444 (1988-10-01), Cordani
patent: 5076864 (1991-12-01), Tanaka

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