Process for producing multilayer printed wiring board

Details Process for producing multilayer printed wiring board Process for producing multilayer printed wiring board

1989-09-06

1991-12-31

Silverberg, Sam

Metal treatment

Process of modifying or maintaining internal physical...

Processes of coating utilizing a reactive composition which...

148272, 427 97, H05K 100

Patent

active

050768646

ABSTRACT:
A process for producing a multilayer printed wiring board, characterized in that copper surface of internal layer(s) is chemically oxidized, thereby forming a brown or black, oxidized copper surface on the internal layer board; and said oxidized copper surface of said internal layer board is treated with an acidic aqueous solution of a reducing agent containing at least one material selected from the group consisting of zinc formaldehyde sulfoxylate and sodium hypophosphite.

REFERENCES:
patent: 4775444 (1988-10-01), Cordani

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