Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole
Patent
1997-06-06
1999-03-09
Powell, William
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating of groove or through hole
216 20, 216 34, 216 65, B44C 122
Patent
active
058795685
ABSTRACT:
A multilayer printed circuit board small in interlayer thickness, capable of fine wiring, minimized in IVH and BVH diameters, high in strength and also excellent in wire bonding workability can be produced by a process comprising the steps of coating a thermosetting resin varnish compounded with electrically insulating whiskers on a roughened side of a copper foil, semi-curing the resin by heating to form a thermosetting resin layer, integrally laminating it on an interlayer board in which plated through-holes and conductor circudits have been formed, and roughening the cured thermosetting resin layer on the via hole wall surfaces with a roughening agent.
REFERENCES:
patent: 4943346 (1990-07-01), Mattelin
patent: 5263243 (1993-11-01), Taneda et al.
patent: 5567329 (1996-10-01), Rose et al.
patent: 5651899 (1997-07-01), Schmidt et al.
Arike Shigeharu
Fujimoto Daisuke
Ito Toyoki
Kobayashi Kazuhito
Nakaso Akishi
Hitachi , Ltd.
Powell William
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