Metal working – Method of mechanical manufacture – Electrical device making
Patent
1996-10-28
1998-09-15
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
156233, 174250, H05K 302
Patent
active
058061770
ABSTRACT:
A process for producing a multilayer printed circuit board which comprises coating a light and heat curable undercoating agent on an internal layer circuit board, irradiating the undercoating agent with active energy beams to make the same tack-free, then laminating thereto a metal foil having an insulating adhesive layer and subsequently heating the resulting assembly to integrally cure the same. When the undercoating agent is coated on an internal layer circuit board and irradiated with a light to be made tack-free, and thereto is laminated a copper foil having a thermosetting insulating adhesive by a rigid roll or the like, the undercoating agent is softened or fluidized and the surface is smoothened. When the resulting laminate is thereafter heated, the undercoating agent coated on the internal layer circuit board and the insulating adhesive coated on the copper foil are integrally cured. Since the insulating adhesive coated on the metal foil keeps the thickness, a multilayer printed circuit board having an excellent board thickness precision can be produced without depending on the percentage of the remaining copper foil in the internal layer.
REFERENCES:
patent: 4528064 (1985-07-01), Ohsawa et al.
patent: 4687528 (1987-08-01), Held
patent: 5592737 (1997-01-01), Middleman et al.
Honjoya Tomoyoshi
Hosomi Takeshi
Kishi Toyoaki
Mitsui Masahiro
Nakamichi Sei
Arbes Carl J.
Sumitomo Bakelite Company Limited
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