Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2011-05-17
2011-05-17
Aftergut, Jeff H (Department: 1746)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C029S825000
Reexamination Certificate
active
07943001
ABSTRACT:
A process for producing a multilayer board includes the steps of applying a bonding ink to the terminal of the first substrate, the bonding ink including a thermosetting resin containing a filler and a curing agent, the filler being formed of metal particles plated with solder, the metal particles each having a first melting point, and the solder having a second melting point lower than the first melting point; bonding the second substrate to a bonding sheet composed of a thermosetting resin and having a through hole disposed in a portion corresponding to the terminal of the second substrate; and heating and pressurizing the first and second substrates with the bonding sheet in such a manner that the terminals are opposite each other to effect curing of the bonding sheet and the bonding ink and to form an integral structure.
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English Translation of the Chinese Office Action dated Aug. 28, 2009.
Date Hiroaki
Fukuzono Kenji
Iida Kenji
Kanda Takashi
Maehara Yasutomo
Aftergut Jeff H
Fujitsu Limited
Kratz Quintos & Hanson, LLP
Lee Jaeyun
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