Electrolysis: processes – compositions used therein – and methods – Electroforming or composition therefor
Patent
1994-03-10
1996-03-26
Niebling, John
Electrolysis: processes, compositions used therein, and methods
Electroforming or composition therefor
205 70, 205 75, 205 78, 205 79, C25D 100
Patent
active
055017843
ABSTRACT:
A microstructured mold with at least one open cavity is produced from a solid body (metal, ceramic, glass, stone or monocrystalline material) by precision mechanical machining, additive or subtractive structuring. The cavity is filled and the mold covered by a flowable material and the solidified flowable material is separated from the mold giving a microstructure element. Alternatively, the top portion of the solidified flowable material is removed to expose the surface of the mold and the solidified material filling the cavity. A layer of conductive material is applied to the exposed surface and remaining solidified material. Then the conductive layer and the remaining solidified material are separated from the mold to provide a structure with a shape complementary to the mold. A layer of metal is electrodeposited on the complementary structure and, finally, the metal layer is separated to produce a metallic microstructure element. The microstructure elements produced by the process have good material properties and can be prepared in a broad range of shapes and structures.
REFERENCES:
patent: 4661212 (1987-04-01), Ehrfeld et al.
patent: 5055163 (1991-10-01), Bier et al.
patent: 5234571 (1993-08-01), Noeker
Eicher Joachim
Lessmo/ llmann Christoph
Reinecke Holger
Leader William T.
MicroParts GmbH
Niebling John
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