Process for producing microelectromechanical components and...

Details Process for producing microelectromechanical components and... Process for producing microelectromechanical components and...

2007-10-23

2007-10-23

Lee, Hsien-Ming (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

C257S432000, C257S444000, C438S022000, C438S032000, C438S048000

Reexamination Certificate

active

11378962

ABSTRACT:
A process produces microelectromechanical components from a substrate that has a first side and a second side which is substantially opposite from the first side, and at least the first side has at least one microelectromechanical element. The process includes the step of providing at least one conductive passage into the substrate, connecting the first side to the second side, and securing at least one support to the first side of the substrate, with the at least one electrically conductive passage uncovered by thinning the substrate material with the mechanical stability being ensured by the support.

REFERENCES:
patent: 2002/0135069 (2002-09-01), Wood et al.

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