Process for producing metal-polyimide composite article

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427123, 427125, 428458, C23C 2600

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active

051339897

ABSTRACT:
The present invention provides a process for producing a metal-polyimide composite material such as a wiring board. In production thereof, deterioration of polyamide film due to oxidation during imidization of a polyimide precursor in contact with metal such as copper or silver can be prevented. The present invention is characterized by using a polyimide precursor having an acidic functional group which is masked. Examples of the polyamide precursor are polyamic acid epoxy adducts, amido polyamic acids, silylated polyamic acids, etc.

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