Process for producing ink jet recording head

Details Process for producing ink jet recording head Process for producing ink jet recording head

1997-05-23

2000-03-07

Powell, William

Etching a substrate: processes

Forming or treating thermal ink jet article

216 2, 216 33, 216 56, B44C 122

Patent

active

060335815

ABSTRACT:
A process for producing an ink jet recording head comprising a silicon substrate having an ink discharge pressure generating element for discharging ink, a discharge opening from which an ink is discharged, provided above the silicon substrate, an ink flow path communicating with the discharge opening, an ink feed opening through which the ink is fed to the ink flow path, and a support for supporting the silicon substrate, and being able to discharge a plurality of different inks, the process comprises the steps of subjecting the silicon substrate to anisotropic etching to form the ink feed opening for each ink and to simultaneously form a groove around the ink feed opening of the silicon substrate, and bonding the silicon substrate to the support in such a state that a protrusion provided on the support at its part corresponding to the groove of the silicon substrate is fitted to the groove.

REFERENCES:
patent: 4786357 (1988-11-01), Campanelli et al.
patent: 5436650 (1995-07-01), Kobayashi et al.
patent: 5479197 (1995-12-01), Fujikawa et al.
patent: 5491505 (1996-02-01), Suzuki et al.
patent: 5580468 (1996-12-01), Fujikawa et al.

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