Process for producing high purity silicon carbide powder for pre

Single-crystal – oriented-crystal – and epitaxy growth processes; – Forming from vapor or gaseous state – Including change in a growth-influencing parameter

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117951, 501 87, 501 88, 423345, C30B 2936

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058633251

ABSTRACT:
A process for producing high purity silicon carbide uses a high purity tetraethoxysilane or the like as the silicon source and a novolak-type phenol resin or the like as the carbon source. The process comprises a step of forming silicon carbide in which silicon carbide powder is prepared by calcining a mixture of these sources in a non-oxidizing atmosphere, and a step of post-treating silicon carbide in which the silicon carbide powder thus obtained is treated by heating at a temperature of 2000.degree. to 2100.degree. C. for 5 to 20 minutes at least once while the silicon carbide powder is kept at a temperature of 1700.degree. or higher to lower than 2000.degree. C., to obtain silicon carbide powder having an average particle diameter of 10 to 500 .mu.m and a content of impurity elements of 0.5 ppm or less. The high purity silicon carbide powder is advantageously used as a material for producing an excellent silicon carbide single crystal having a decreased number of crystal defects.

REFERENCES:
patent: 4996174 (1991-02-01), Birchall et al.
patent: 5433167 (1995-07-01), Furukawa et al.
WPI Abstract 94-252502/31 of JP060183718 A Bridgestone Jul. 5, 1994.
WPI Abstract 86-240922/37 of JP610168514 A Bridgestone Jul. 30, 1986.

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