Process for producing high density conductive lines

Details Process for producing high density conductive lines Process for producing high density conductive lines

1994-06-13

1995-07-04

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437193, 437200, 437245, 437 50, H01L 2144

Patent

active

054299888

ABSTRACT:
A process of fabricating a semiconductor device on a substrate with closely spaced high density conductive lines is provided. A thin insulating layer is formed on the surface of a substrate. Next, a blanket conductive layer and a blanket masking layer are deposited over the first insulating layer. Using conventional photolithography processes and plasma etching, elongated spaced parallel masking lines with vertical sidewalls are formed in the masking layer. A blanket polycrystalline silicon layer is deposited on the masking lines and the exposed areas of the conductive layer. Next, the blanket polycrystalline silicon layer is anisotrophically etched to form spacers on the vertical sidewalls of the masking lines. A second planarized masking layer is formed over the spacers and masking lines. The polycrystalline silicon spacers and the underlying first polycrystalline silicon layer are anisotrophically etched to form the closely spaced conductive lines in the first polycrystalline silicon layer. A coating of electrically isolating material is formed between and over the conductive lines.

REFERENCES:
patent: 4502914 (1985-03-01), Trumpp et al.
patent: 4776922 (1988-10-01), Bhattacharyya et al.
patent: 5236853 (1993-08-01), Hsue
patent: 5310693 (1994-05-01), Hsue
patent: 5328810 (1994-07-01), Lowrey et al.
patent: 5330924 (1994-07-01), Huang et al.

Affiliated with

Also associated with

Rating

Process for producing high density conductive lines does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for producing high density conductive lines, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for producing high density conductive lines will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-759860