Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1990-11-16
1992-12-01
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
4273881, 4273885, B05D 714
Patent
active
051679850
ABSTRACT:
A process for producing a flexible printed circuit board comprising a metallic foil and a polyimide is provided, which comprises coating a metallic foil with a resin solution prepared by adding a tertiary amino compound to a solution of a polyamic acid (a polyimide precursor) represented by the following general formula (I): ##STR1## followed by the imidization thereof, the amount of said tertiary amino compound added to the solution being 10 to 50 parts by weight per 100 parts by weight of solid polyamic acid contained in said resin solution. According to the present invention, a flexible printed circuit board which is free from curling, wrinkling and warping, and which has excellent heat resistance, electrical characteristics and mechanical properties is provided with a simplified production process.
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patent: 4512893 (1985-04-01), Makino et al.
patent: 4670325 (1987-06-01), Bakos et al.
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patent: 4830640 (1989-05-01), Nakamura et al.
patent: 4839217 (1989-06-01), Tabata et al.
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patent: 4948400 (1990-08-01), Yamada et al.
Furutani Hiroyuki
Ito Hiroshi
Nagano Hirosaku
Nojiri Hitoshi
Beck Shrive
Dudash Diana L.
Kanegafuchi Kagaku Kogyo K.K.
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