Process for producing electrical connections through a substrate

Details Process for producing electrical connections through a substrate Process for producing electrical connections through a substrate

1989-09-08

1990-10-23

Hall, Carl E.

Metal working

Method of mechanical manufacture

Electrical device making

204 15, 21912168, 21912169, 437173, H01K 310

Patent

active

049642120

ABSTRACT:
According to the invention, blind holes (27) and not through-holes are produced. For this purpose, the substrate (10) to be pierced or perforated is previously covered with a layer (12) less absorbing for the laser perforating beam (26) than the substrate.
Application to the production of electronic circuits, magnetic recording devices, etc.

REFERENCES:
patent: 3526009 (1971-02-01), Cranston et al.
patent: 4348253 (1982-09-01), Subbarao et al.
patent: 4417393 (1983-11-01), Becker
patent: 4642160 (1987-02-01), Burgess
patent: 4842699 (1989-06-01), Hua et al.
IBM Technical Disclosure Bulletin, vol. 15, No. 2, "Kerf Oxide Trench for Laser Dicing", T. Bkaer et al., Jul. 1972.
Electronics International, vol. 55, No. 11, "Laser Drills 5-mil Blind Vias", Jerry Lyman, Jun. 1982, p. 48.

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