Etching a substrate: processes – Forming or treating an article whose final configuration has...
Patent
1995-09-18
1998-03-31
Powell, William
Etching a substrate: processes
Forming or treating an article whose final configuration has...
216 41, 216 52, 216100, B44C 122, C23F 100
Patent
active
057334650
ABSTRACT:
A cutting die is produced by a process of forming resist patterns corresponding to the shapes of low cutting edges and resist patterns corresponding to the shapes of high cutting edges on a metal plate and conducting an etching treatment on the metal plate, wherein the height of each of the cutting edges is varied by varying the width of the relevant resist pattern, varying the timing of removing the relevant resist pattern and applying or not applying sealing treatment thereto. This process enables easy production of a cutting die provided either with low cutting edges and high cutting edges or with embossing parts and high cutting edges. Further, the use of this cutting die enables simultaneous execution of full cutting and half cutting (or embossing) operations, so that labels, box development base papers and the like can be produced by a single process.
REFERENCES:
patent: 4497686 (1985-02-01), Weglin
patent: 4579022 (1986-04-01), Kasai et al.
patent: 4579634 (1986-04-01), Weglin
patent: 5248383 (1993-09-01), Hanada
Hayashi Ryuichi
Kitamura Yoshihito
Ogawa Shigeo
Sumikawa Yasuo
Lintec Corporation
Powell William
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