Process for producing cured products

Plastic and nonmetallic article shaping or treating: processes – Forming electrical articles by shaping electroconductive...

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252512, 252518, 264236, 264347, H01B 102

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active

041221435

ABSTRACT:
Process for producing conductive cured products are disclosed. In one embodiment a copper compound is reacted with a reducing substance capable of reducing said copper compound to metallic copper, in the presence of a metallic copper powder on a substrate, thereby reducing the copper compound to metallic copper and forming a conductive connected unit of said metallic copper powder, and the connected unit is then subjected to cure molding with a resinous curable component to integrate the constituent elements into the conductive cured product. In a second embodiment, the ligand portion of a copper compound of a ligand capable of reducing copper in a compound state is reacted with the copper moiety present in said copper compound in the presence of a metallic copper powder on a substrate. The copper moiety is reduced and precipitated to form a conductive connected unit of a metallic copper powder and the connected unit is then subjected to cure molding with a resinous curable component.

REFERENCES:
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patent: 3014818 (1961-12-01), Campbell
patent: 3056750 (1962-10-01), Pass
patent: 3360589 (1967-12-01), Raichle et al.
patent: 3474464 (1969-10-01), Matthews et al.
patent: 3647532 (1972-03-01), Friedman et al.
patent: 3867315 (1975-02-01), Tigner et al.
patent: 3983075 (1976-09-01), Marshall et al.

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