Process for producing copper-clad laminate

Details Process for producing copper-clad laminate Process for producing copper-clad laminate

1990-06-22

1992-03-17

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156233, 156249, 156631, 156902, 205 76, 205187, B32B 3100, C23F 102, B44C 122

Patent

active

050965220

ABSTRACT:
A process for producing a copper-clad laminate is disclosed which includes the steps of (a) contacting the surface of a conductive carrier with a catalyst liquid containing at least one noble metal selected from the group consisting of Pd, Pt, Ru, Au, and Ag; (b) subsequently forming a copper foil layer on the treated surface of the conductive carrier by copper electroplating; (c) laminating an insulating base on the copper foil layer by hot-press bonding; and (d) separating the conductive carrier from the resulting laminate. The copper foil layer in the resulting copper-clad laminate has reduced pinholes and exhibits isotropic mechanical characteristics.

REFERENCES:
patent: 2984595 (1961-05-01), Schumpelt et al.
patent: 3099608 (1963-07-01), Radovsky et al.
patent: 3152938 (1964-10-01), Osifchin et al.
patent: 4715116 (1987-12-01), Thorpe et al.
patent: 4790902 (1988-12-01), Wada et al.

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