Process for producing components

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies

Reexamination Certificate

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Details

C438S455000, C438S460000, C438S464000, C438S127000, C257SE21599

Reexamination Certificate

active

07736995

ABSTRACT:
The invention relates to a process for producing components, in particular small glass plates such as windows for optical caps for optical components. The process includes providing a substrate, providing a carrier, joining a first surface of the substrate to a first surface of the carrier, machining the components out of the substrate, and detaching the components from the carrier in order to separate the components.

REFERENCES:
patent: 3417642 (1968-12-01), Kempenaers
patent: 3694972 (1972-10-01), Emeis
patent: 4138304 (1979-02-01), Gantley
patent: 4828052 (1989-05-01), Duran et al.
patent: 6319754 (2001-11-01), Wang et al.
patent: 2002/0096743 (2002-07-01), Spooner et al.
patent: 2003/0148057 (2003-08-01), Dietz et al.
patent: 557091 (1974-12-01), None
patent: 1420849 (2003-05-01), None
patent: 0279949 (1988-08-01), None
patent: 6304899 (1995-03-01), None
“Bearbeiten Keramischer Werkstoffe Mit Dem Ultraschallschwinglappen,” Technische Rundschau, Hallwag Verlag. Bern, CH, Bd. 83, No. 37, Sep. 13, 1991, pp. 26, 28.
English Translation of: “Bearbeiten Keramischer Werkstoffe Mit Dem Ultraschallschwinglappen,” Technische Rundschau, Hallwag Verlag. Bern, Ch, Bd. 83, No. 37, Sep. 13, 1991, pp. 26, 28.
“Optics, Mechanics and Electronics Information,” vol. 13, No. 11, p. 9, col. 2, 1996.

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